"Experimental study of filling behaviors in the underfill encapsulation of ..."

Meng-Fu Shih, Wen-Bin Young (2009)

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DOI: 10.1016/J.MICROREL.2009.07.056

access: closed

type: Journal Article

metadata version: 2020-02-22

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Meng-Fu Shih, Wen-Bin Young:
Experimental study of filling behaviors in the underfill encapsulation of a flip-chip. Microelectron. Reliab. 49(12): 1555-1562 (2009)

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