"Vacuum effect on the void formation of the molded underfill process in ..."

Xue-Ru Guo, Wen-Bin Young (2015)

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DOI: 10.1016/J.MICROREL.2014.12.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Xue-Ru Guo, Wen-Bin Young:
Vacuum effect on the void formation of the molded underfill process in flip chip packaging. Microelectron. Reliab. 55(3-4): 613-622 (2015)

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