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2020 – today
- 2021
[j3]Ki Chul Chun
, Yong-Ki Kim, Yesin Ryu, Jaewon Park, Chi Sung Oh, Young-Yong Byun, So-Young Kim, Dong-Hak Shin, Jun Gyu Lee, Byung-Kyu Ho, Min-Sang Park, Seong-Jin Cho, Seunghan Woo, Byoung-Mo Moon, Beomyong Kil, Sungoh Ahn, Jae Hoon Lee, Sooyoung Kim, Seouk-Kyu Choi, Jae-Seung Jeong, Sung-Gi Ahn, Jihye Kim, Jun Jin Kong, Kyomin Sohn, Nam Sung Kim, Jung-Bae Lee:
A 16-GB 640-GB/s HBM2E DRAM With a Data-Bus Window Extension Technique and a Synergetic On-Die ECC Scheme. IEEE J. Solid State Circuits 56(1): 199-211 (2021)- 2020
- [c4]Chi-Sung Oh, Ki Chul Chun, Young-Yong Byun, Yong-Ki Kim, So-Young Kim, Yesin Ryu, Jaewon Park, Sinho Kim, Sang-uhn Cha, Dong-Hak Shin, Jungyu Lee, Jong-Pil Son, Byung-Kyu Ho, Seong-Jin Cho, Beomyong Kil, Sungoh Ahn, Baekmin Lim, Yong-Sik Park, Kijun Lee, Myung-Kyu Lee, Seungduk Baek, Junyong Noh, Jae-Wook Lee, Seungseob Lee, Sooyoung Kim, Bo-Tak Lim, Seouk-Kyu Choi, Jin-Guk Kim, Hye-In Choi, Hyuk-Jun Kwon, Jun Jin Kong, Kyomin Sohn, Nam Sung Kim, Kwang-Il Park, Jung-Bae Lee:
22.1 A 1.1V 16GB 640GB/s HBM2E DRAM with a Data-Bus Window-Extension Technique and a Synergetic On-Die ECC Scheme. ISSCC 2020: 330-332
2010 – 2019
- 2017
- [j2]Kyomin Sohn, Won-Joo Yun, Reum Oh, Chi-Sung Oh, Seong-Young Seo, Min-Sang Park, Dong-Hak Shin, Won-Chang Jung, Sang-Hoon Shin, Je-Min Ryu, Hye-Seung Yu, Jae-Hun Jung, Hyunui Lee, Seok-Yong Kang, Young-Soo Sohn, Jung-Hwan Choi, Yong-Cheol Bae, Seong-Jin Jang, Gyo-Young Jin:
A 1.2 V 20 nm 307 GB/s HBM DRAM With At-Speed Wafer-Level IO Test Scheme and Adaptive Refresh Considering Temperature Distribution. IEEE J. Solid State Circuits 52(1): 250-260 (2017) - 2016
- [c3]Kyomin Sohn, Won-Joo Yun, Reum Oh, Chi-Sung Oh, Seong-Young Seo, Min-Sang Park, Dong-Hak Shin, Won-Chang Jung, Sang-Hoon Shin, Je-Min Ryu, Hye-Seung Yu, Jae-Hun Jung, Kyung-Woo Nam, Seouk-Kyu Choi, Jaewook Lee, Uksong Kang, Young-Soo Sohn, Jung-Hwan Choi, Chi-Wook Kim, Seong-Jin Jang, Gyo-Young Jin:
18.2 A 1.2V 20nm 307GB/s HBM DRAM with at-speed wafer-level I/O test scheme and adaptive refresh considering temperature distribution. ISSCC 2016: 316-317 - 2014
- [j1]Seokmin Hong, Dong-Hak Shin, Joon-Jae Lee, Byung-Gook Lee:
Viewing Angle-Improved 3D Integral Imaging Display with Eye Tracking Sensor. J. Inform. and Commun. Convergence Engineering 12(4): 208-214 (2014) - 2010
- [c2]Ho-Hyun Kang, Jung-Woo Lee, Dong-Hak Shin, Eun-Soo Kim:
Efficient compression scheme by use of the region division of elemental images on MALT in three-dimensional integral imaging. Three-Dimensional Image Processing (3DIP) and Applications 2010: 75260I
2000 – 2009
- 2009
- [c1]Nam Woo Kim, Dong-Hak Shin, Dong-Jin Kim, Byung-Gook Lee, Eun-Soo Kim:
Vision-Based 3D Fingertip Interface for Spatial Interaction in 3D Integral Imaging System. CISIS 2009: 1006-1011
Coauthor Index
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