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Hong Gao 0003
Person information
- affiliation: Tianjin University, School of Chemical Engineering and Technology, China
Other persons with the same name
- Hong Gao — disambiguation page
- Hong Gao 0001 — Harbin Institute of Technology, School of Computer Science and Technology, China
- Hong Gao 0002 — Dalian Maritime University, Department of Mathematics, China
- Hong Gao 0004 — Beijing University of Posts and Telecommunications, School of Telecommunication Engineering, China
- Hong Gao 0005 — Nanjing University of Information Science and Technology, School of Economics and Management, China
- Hong Gao 0006 — Fujitsu Laboratories Ltd., Japan
- Hong Gao 0007 — Capital Normal University, School of Mathematical Sciences, Beijing, China
- Hong Gao 0008 — University of Tübingen, Germany
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2010 – 2019
- 2016
- [j7]Hong Gao, Wenguo Zhang, Zhe Zhang, Li-Lan Gao, Gang Chen:
Study on fatigue life and electrical property of COG assembly under thermal-electric-mechanical coupled loads. Microelectron. Reliab. 56: 148-154 (2016) - [j6]Fan Li, Wenguo Zhang, Li-Lan Gao, Hong Gao:
The coupled effects of salt-spray corrosion, electrical current and mechanical load on the electrical and fatigue properties of COG assembly. Microelectron. Reliab. 66: 92-97 (2016) - 2015
- [j5]Wenguo Zhang, Jian-hua Ma, Li-Lan Gao, Zhe Zhang, Hong Gao:
Fatigue life and resistance analysis of COG assemblies under hygrothermal aging. Microelectron. Reliab. 55(3-4): 623-629 (2015) - [j4]Li-Lan Gao, Xu Chen, Hong Gao:
Interfacial thermal stresses in ACF bonding assembly. Microelectron. Reliab. 55(7): 1089-1096 (2015) - 2014
- [j3]Hong Gao, Jian-hua Ma, Li-Lan Gao, Dong Zhang:
Fatigue and resistance analysis of COG modules using electro-mechanical coupling method. Microelectron. Reliab. 54(4): 816-824 (2014) - [j2]Hong Gao, Dong Zhang, Li-Lan Gao, Jian-hua Ma:
The coupling effects of temperature, electric current and stress on the adhesion and electrical properties of COG assembly. Microelectron. Reliab. 54(8): 1603-1612 (2014) - 2011
- [j1]Li-Lan Gao, Lei Wang, Hong Gao, Gang Chen, Xu Chen:
Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads. Microelectron. Reliab. 51(8): 1393-1397 (2011)
Coauthor Index
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