"Interfacial thermal stresses in ACF bonding assembly."

Li-Lan Gao, Xu Chen, Hong Gao (2015)

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DOI: 10.1016/J.MICROREL.2015.04.004

access: closed

type: Journal Article

metadata version: 2020-09-01

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Li-Lan Gao, Xu Chen, Hong Gao:
Interfacial thermal stresses in ACF bonding assembly. Microelectron. Reliab. 55(7): 1089-1096 (2015)

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