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ORCIDEric W. MacDonald
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2020 – today
- 2024
[j13]Alexander Gomez
, Bharat Yelamanchi, Alexis Maurel, Ana C. Martinez, Thomas Feldhausen, Jayaprakash Shivakumar, Eduardo Rojas, Yirong Lin, Pedro Cortes, Eric W. MacDonald, David A. Roberson:
3D Printed Alumina for Geometrically-Complex Electronic Substrates With High-Performance Printed Conductors. IEEE Access 12: 92295-92305 (2024)- 2023
- [i1]Khaled I. Alsharif, Alexander H. Pesch, Vamsi Borra, Pedro Cortes, Eric W. MacDonald, Frank X. Li, Kyosung Choo:
Transient Thermal and Electrical Characteristics of a Cylindrical LiFeS2 Cell with Equivalent Circuit Model. CoRR abs/2311.02095 (2023) - 2022
- [j12]Khaled I. Alsharif, Alexander H. Pesch, Vamsi Borra, Frank X. Li, Pedro Cortes, Eric W. MacDonald, Kyosung Choo:
A Novel Modal Representation of Battery Dynamics. IEEE Access 10: 16793-16806 (2022) - [j11]Khaled I. Alsharif, Alexander H. Pesch, Vamsi Borra, Frank X. Li, Pedro Cortes, Eric W. MacDonald, Kyosung Choo:
A Coupled Thermo-Mechanical Dynamic Characterization of Cylindrical Batteries. IEEE Access 10: 51708-51722 (2022) - [c11]Grant Parker, Eric W. MacDonald, Theo Zinner, Mark Yampolskiy:
3D-Mold'ed In-Security: Mapping Out Security of Indirect Additive Manufacturing. CPSS@AsiaCCS 2022: 53-61 - 2021
- [j10]Andrei-Alexandru Popa, Alin Drimus, Eric W. MacDonald, Lars Duggen:
A Conformal, Optimized 3D Printed Kneepad With Deformation Sensing. IEEE Access 9: 126873-126881 (2021) - [j9]Alexis Maurel, Ana C. Martinez, Sylvie Grugeon, Stéphane Panier, Loic Dupont, Pedro Cortes, Cameroun G. Sherrard, Ian Small, Sreeprasad T. Sreenivasan, Eric W. MacDonald:
Toward High Resolution 3D Printing of Shape-Conformable Batteries via Vat Photopolymerization: Review and Perspective. IEEE Access 9: 140654-140666 (2021) - 2020
- [j8]Carolyn Carradero Santiago, Christiaan Randall-Posey, Andrei-Alexandru Popa, Lars Duggen, Brian Vuksanovich, Pedro Cortes, Eric W. MacDonald:
3D Printed Elastomeric Lattices With Embedded Deformation Sensing. IEEE Access 8: 41394-41402 (2020) - [j7]Carolyn Carradero Santiago, Christiaan Randall-Posey, Andrei-Alexandru Popa, Lars Duggen, Brian Vuksanovich, Pedro Cortes, Eric W. MacDonald:
Corrections to "3D Printed Elastomeric Lattices With Embedded Deformation Sensing". IEEE Access 8: 87184 (2020)
2010 – 2019
- 2019
- [j6]Kerry Johnson, Michael Zemba, Brett P. Conner, Jason Walker, Edward Burden, Kirk Rogers, Kevin R. Cwiok, Eric W. MacDonald, Pedro Cortes:
Digital Manufacturing of Pathologically-Complex 3D Printed Antennas. IEEE Access 7: 39378-39389 (2019) - [c10]Andrei Popa, Brian Zellers, Simon Iversen, Dillon Kennedy, Pedro Cortes, Lars Duggen, Jérôme Jouffroy, Kirk Rogers, Brett P. Conner, Eric W. MacDonald:
3D Printed Hybrid Flexible Electronics with Direct Light Synthesis. AHFE (24) 2019: 83-92 - 2018
- [j5]Callum Bailey, Efrain Aguilera, David Espalin, Jose Motta, Alfonso Fernández, Mireya A. Perez, Christopher Dibiasio, Dariusz Pryputniewicz, Eric W. MacDonald, Ryan B. Wicker:
Augmenting Computer-Aided Design Software With Multi-Functional Capabilities to Automate Multi-Process Additive Manufacturing. IEEE Access 6: 1985-1994 (2018) - 2017
- [j4]Chiyen Kim, David Espalin, Min Liang, Hao Xin, Alejandro Cuaron, Issac Varela, Eric W. MacDonald, Ryan B. Wicker:
3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect. IEEE Access 5: 25286-25294 (2017) - 2015
- [c9]Chiyen Kim, David Espalin, Alejandro Cuaron, Mireya A. Perez, Eric W. MacDonald, Ryan B. Wicker:
A study to detect a material deposition status in fused deposition modeling technology. AIM 2015: 779-783 - 2014
- [j3]Eric W. MacDonald, Rudy Salas, David Espalin, Mireya Perez, Efrain Aguilera, Dan Muse, Ryan B. Wicker:
3D Printing for the Rapid Prototyping of Structural Electronics. IEEE Access 2: 234-242 (2014)
2000 – 2009
- 2008
- [c8]Ameet Chavan, Eric W. MacDonald, Norman Liu, Joseph Neff:
A novel floating gate circuit family with subthreshold voltage swing for ultra-low power operation. ISCAS 2008: 3354-3357 - 2006
- [j2]Eric W. MacDonald, Nur A. Touba:
Delay testing of partially depleted silicon-on-insulator (PD-SOI) circuits. IEEE Trans. Very Large Scale Integr. Syst. 14(6): 587-595 (2006) - [c7]Ameet Chavan, Gaurav Dukle, Ben Graniello, Eric W. MacDonald:
Robust Ultra-Low Power Subthreshold Logic Flip-Flop Design for Reconfigurable Architectures. ReConFig 2006: 142-148 - [p1]Didier Keymeulen, Michael I. Ferguson, Luke Breuer, Wolfgang Fink, Boris Oks, Chris Peay, Richard Terrile, Yen Cheng, Dennis Kim, Eric W. MacDonald, David Foor:
Hardware Platforms for Electrostatic Tuning of Mems Gyroscope Using Nature-Inspired Computation. Evolvable Hardware 2006: 209-222 - 2005
- [c6]Didier Keymeulen, Michael I. Ferguson, Wolfgang Fink, Boris Oks, Chris Peay, Richard Terrile, Yen Cheng, Dennis Kim, Eric W. MacDonald, David Foor:
Hardware Platforms for MEMS Gyroscope Tuning Based on Evolutionary Computation Using Open-Loop and Closed-Loop Frequency Response. ICES 2005: 215-226 - [c5]Kirti Joshi, Eric W. MacDonald:
Reduction of Instantaneous Power by Ripple Scan Clocking. VTS 2005: 271-276 - 2004
- [c4]Shalini Ghosh, Eric W. MacDonald, Sugato Basu, Nur A. Touba:
Low-power weighted pseudo-random BIST using special scan cells. ACM Great Lakes Symposium on VLSI 2004: 86-91 - 2002
- [j1]Kevin J. Nowka, Gary D. Carpenter, Eric W. MacDonald, Hung C. Ngo, Bishop Brock, Koji I. Ishii, Tuyet Nguyen, Jeffrey L. Burns:
A 32-bit PowerPC system-on-a-chip with support for dynamic voltage scaling and dynamic frequency scaling. IEEE J. Solid State Circuits 37(11): 1441-1447 (2002) - [c3]Eric W. MacDonald, Nur A. Touba:
Very Low Voltage Testing of SOI Integrated Circuits. VTS 2002: 25-30 - 2000
- [c2]Eric W. MacDonald, Nur A. Touba:
Testing domino circuits in SOI technology. Asian Test Symposium 2000: 441-446
1990 – 1999
- 1999
- [c1]Eric W. MacDonald, Nur A. Touba:
Delay testing of SOI circuits: Challenges with the history effect. ITC 1999: 269-275
Coauthor Index
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last updated on 2024-10-07 22:17 CEST by the dblp team
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