"3D Printed Electronics With High Performance, Multi-Layered Electrical ..."

Chiyen Kim et al. (2017)

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DOI: 10.1109/ACCESS.2017.2773571

access: open

type: Journal Article

metadata version: 2023-03-10

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Chiyen Kim, David Espalin, Min Liang, Hao Xin, Alejandro Cuaron, Issac Varela, Eric W. MacDonald, Ryan B. Wicker:
3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect. IEEE Access 5: 25286-25294 (2017)

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