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ORCIDToshitaka Ishizaki
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Journal Articles
- 2017
[j6]Toshitaka Ishizaki
, D. Miura, A. Kuno, K. Hasegawa, Masanori Usui, Y. Yamada:
Young's modulus of a sintered Cu joint and its influence on thermal stress. Microelectron. Reliab. 76-77: 405-408 (2017)- 2016
- [j5]Toshitaka Ishizaki, Daiki Miura, Atsuki Kuno, Ryota Nagao, Syoho Aoki, Yuta Ohshima, Takuma Kino, Masanori Usui, Yasushi Yamada:
Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. Microelectron. Reliab. 64: 287-293 (2016) - 2015
- [j4]Toshitaka Ishizaki, Masashi Yanase, A. Kuno, T. Satoh, Masanori Usui, F. Osawa, Yasushi Yamada:
Thermal simulation of joints with high thermal conductivities for power electronic devices. Microelectron. Reliab. 55(7): 1060-1066 (2015) - [j3]Toshitaka Ishizaki, Masanori Usui, Y. Yamada:
Thermal cycle reliability of Cu-nanoparticle joint. Microelectron. Reliab. 55(9-10): 1861-1866 (2015) - 2014
- [j2]Toshitaka Ishizaki, A. Kuno, A. Tane, Masashi Yanase, F. Osawa, T. Satoh, Yasushi Yamada:
Reliability of Cu nanoparticle joint for high temperature power electronics. Microelectron. Reliab. 54(9-10): 1867-1871 (2014) - 2013
- [j1]Toshitaka Ishizaki, T. Satoh, A. Kuno, A. Tane, Masashi Yanase, F. Osawa, Yasushi Yamada:
Thermal characterizations of Cu nanoparticle joints for power semiconductor devices. Microelectron. Reliab. 53(9-11): 1543-1547 (2013)
Coauthor Index
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