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Aziz Oukaira
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Journal Articles
- 2024
- [j5]Dhaou Said, Miloud Bagaa, Aziz Oukaira, Ahmed Lakhssassi:
Quantum Entropy and Reinforcement Learning for Distributed Denial of Service Attack Detection in Smart Grid. IEEE Access 12: 129858-129869 (2024) - [j4]Aziz Oukaira, Dhaou Said, Touati Djallel eddine, Nader El-Zarif, Ahmad Hassan, Yvon Savaria, Ahmed Lakhssassi:
Novel Peak-Source-Scanning (NPSS) Model for Thermal Control of Systems-in-Package (SiP). IEEE Access 12: 143842-143853 (2024) - [j3]Nader El-Zarif, Mostafa Amer, Mohamed Ali, Ahmad Hassan, Aziz Oukaira, Christian Jesús B. Fayomi, Yvon Savaria:
Calibration of Ring Oscillator-Based Integrated Temperature Sensors for Power Management Systems. Sensors 24(2): 440 (2024) - 2022
- [j2]Aziz Oukaira, Ahmad Hassan, Mohamed Ali, Yvon Savaria, Ahmed Lakhssassi:
Towards Real-Time Monitoring of Thermal Peaks in Systems-on-Chip (SoC). Sensors 22(15): 5904 (2022) - 2020
- [j1]Ouafaa Ettahri, Aziz Oukaira, Mohamed Ali, Ahmad Hassan, Morteza Nabavi, Yvon Savaria, Ahmed Lakhssassi:
A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces. Sensors 20(19): 5657 (2020)
Conference and Workshop Papers
- 2024
- [c9]Amrou Zyad Benelhaouare, Aziz Oukaira, Maroua Oumlaz, Ahmed Lakhssassi:
Enhancing Thermal Security of 3D-SiP Systems through Thermal Digital Twin (TDT). CCECE 2024: 20-24 - [c8]Amrou Zyad Benelhaouare, Aziz Oukaira, Maroua Oumlaz, Ahmed Lakhssassi:
Efficient Thermal Management Strategies for 3D-SiP Architectures. IMCOM 2024: 1-5 - 2023
- [c7]Aziz Oukaira, Dhaou Said, Jamal Zbitou, Ahmed Lakhssassi:
Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC). IMCOM 2023: 1-5 - 2022
- [c6]Aziz Oukaira, Dhaou Said, Jamal Zbitou, Ahmed Lakhssassi:
Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM). ICM 2022: 30-33 - [c5]Nader El-Zarif, Mohamed Ali, Mostafa Amer, Ahmad Hassan, Aziz Oukaira, Ahmed Lakhssassi, Christian Jesús B. Fayomi, Yvon Savaria:
Investigation of Different Integrated Temperature Monitoring Sensors for High-Voltage SoC DC-DC Converters. NEWCAS 2022: 178-182 - 2021
- [c4]Aziz Oukaira, Touati Djallel eddine, Ahmad Hassan, Mohamed Ali, Yvon Savaria, Ahmed Lakhssassi:
Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs). MWSCAS 2021: 630-634 - [c3]Touati Djallel eddine, Aziz Oukaira, Ahmad Hassan, Yvon Savaria, Ahmed Lakhssassi:
Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies. NEWCAS 2021: 1-4 - 2017
- [c2]Safa Saadaoui, Mohamed Tabaa, Fabrice Monteiro, Mouhamad Chehaitly, Abbas Dandache, Aziz Oukaira:
IWSN under an industrial wireless channel in the context of Industry 4.0. ICM 2017: 1-4 - [c1]Aziz Oukaira, Réjean Fontaine, Roger Lecomte, Ahmed Lakhssassi:
Thermal cooling system development for LabPET II scanners by forced convection flow. NEWCAS 2017: 289-292
Coauthor Index
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