"Transient Thermal Analysis of System-in-Package Technology by the Finite ..."

Aziz Oukaira et al. (2022)

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DOI: 10.1109/ICM56065.2022.10005514

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type: Conference or Workshop Paper

metadata version: 2024-10-06

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Aziz Oukaira, Dhaou Said, Jamal Zbitou, Ahmed Lakhssassi:
Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM). ICM 2022: 30-33

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