"Finite Element Method for System-in-Package (SiP) Technology: Thermal ..."

Aziz Oukaira et al. (2023)

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DOI: 10.1109/IMCOM56909.2023.10035652

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Aziz Oukaira, Dhaou Said, Jamal Zbitou, Ahmed Lakhssassi:
Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC). IMCOM 2023: 1-5

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