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ORCIDMohd Zulkifly Abdullah
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2020 – today
- 2021
[j27]Nazmi Che Ismail
, Mohd Zulkifly Abdullah, Khairil Faizi Mustafa, Nurul Musfirah Mazlan, Prem Gunnasegaran, Agustinus Purna Irawan:
Double-Layer Micro Porous Media Burner from Lean to Rich Fuel Mixture: Analysis of Entropy Generation and Exergy Efficiency. Entropy 23(12): 1663 (2021)- [j26]Seng Man Wong, Hann Woei Ho, Mohd Zulkifly Abdullah:
Design and Fabrication of a Dual Rotor-Embedded Wing Vertical Take-Off and Landing Unmanned Aerial Vehicle. Unmanned Syst. 9(1): 45-63 (2021) - 2020
- [j25]Nazmi Che Ismail, Mohd Zulkifly Abdullah, Nurul Musfirah Mazlan, Khairil Faizi Mustafa:
Entropy Generation and Exergy Analysis of Premixed Fuel-Air Combustion in Micro Porous Media Burner. Entropy 22(10): 1104 (2020)
2010 – 2019
- 2018
- [j24]Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah:
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. Microelectron. Reliab. 81: 41-63 (2018) - [j23]Srivalli Chellvarajoo, Mohd Zulkifly Abdullah:
Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality. Microelectron. Reliab. 84: 230-237 (2018) - 2017
- [j22]Shaker Farid Sufian, Mohd Zulkifly Abdullah:
Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink. Microelectron. Reliab. 68: 39-50 (2017) - [j21]Chong Hooi Lim, Mohd Zulkifly Abdullah, Ishak Abdul Azid, M. S. Abdul Aziz:
Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board. Microelectron. Reliab. 72: 5-17 (2017) - [j20]Fei Chong Ng, Aizat Abas, Z. L. Gan, Mohd Zulkifly Abdullah, F. Che Ani, M. Yusuf Tura Ali:
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. Microelectron. Reliab. 72: 45-64 (2017) - [j19]A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Z. Samsudin, F. Che Ani:
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. Microelectron. Reliab. 79: 69-78 (2017) - [j18]M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, Abdullah Aziz Saad, Mohd Zulkifly Abdullah:
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages. Microelectron. Reliab. 79: 336-351 (2017) - 2016
- [j17]Aizat Abas, Noorhafizah Hafizah Mokhtar, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Ang H. O. Tian:
Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem. Comput. Math. Methods Medicine 2016: 6143126:1-6143126:17 (2016) - [j16]Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor:
Lattice Boltzmann method study of bga bump arrangements on void formation. Microelectron. Reliab. 56: 170-181 (2016) - [j15]Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Aizat Abas:
Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process. Microelectron. Reliab. 65: 205-216 (2016) - [j14]Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz:
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. Microelectron. Reliab. 66: 143-160 (2016) - 2015
- [j13]M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid:
Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology. Simul. Model. Pract. Theory 57: 45-57 (2015) - 2014
- [j12]C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz:
Influence of solder bump arrangements on molded IC encapsulation. Microelectron. Reliab. 54(4): 796-807 (2014) - [j11]C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, I. A. Azid:
Recent fluid-structure interaction modeling challenges in IC encapsulation - A review. Microelectron. Reliab. 54(8): 1511-1526 (2014) - [j10]Shaker Farid Sufian, Z. M. Fairuz, Mohammed Zubair, Mohd Zulkifly Abdullah, Julie Juliewatty Mohamed:
Thermal analysis of dual piezoelectric fans for cooling multi-LED packages. Microelectron. Reliab. 54(8): 1534-1543 (2014) - 2013
- [j9]C. Y. Khor, Mohd Zulkifly Abdullah:
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging. Microelectron. Reliab. 53(2): 334-347 (2013) - [j8]Ernest E. S. Ong, Mohd Zulkifly Abdullah, W. K. Loh, C. K. Ooi, R. Chan:
FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process. Microelectron. Reliab. 53(4): 600-611 (2013) - [j7]W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor:
Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology. Microelectron. Reliab. 53(12): 1996-2004 (2013) - 2012
- [j6]C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan:
Investigation of the fluid/structure interaction phenomenon in IC packaging. Microelectron. Reliab. 52(1): 241-252 (2012) - [j5]W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor:
Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance. Microelectron. Reliab. 52(4): 744-756 (2012) - [j4]Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani:
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. Microelectron. Reliab. 52(6): 1143-1152 (2012) - [j3]C. Y. Khor, Mohd Zulkifly Abdullah:
Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology. Simul. Model. Pract. Theory 29: 109-122 (2012) - [c1]Motasem H. Ghanim, Kamariah Hasan, Nazalan Najimudin, Mohd Zulkifly Abdullah:
Design of DNA biosensors and amperometric microchips featuring copper electrodes. BHI 2012: 1005-1008 - 2010
- [j2]Nur Afande Ali Hussain, Ting Ming Chung, Mohd Rizal Arshad, Rosmiwati Mohd-Mokhtar, Mohd Zulkifly Abdullah:
Design of an underwater glider platform for shallow-water applications. Int. J. Intell. Def. Support Syst. 3(3/4): 186-206 (2010) - [j1]C. Y. Khor, M. Abdul Mujeebu, Mohd Zulkifly Abdullah, F. Che Ani:
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process. Microelectron. Reliab. 50(1): 98-105 (2010)
Coauthor Index
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