"Effect of solder bump shapes on underfill flow in flip-chip encapsulation ..."

Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah (2018)

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DOI: 10.1016/J.MICROREL.2017.12.025

access: closed

type: Journal Article

metadata version: 2020-02-22

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Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah:
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. Microelectron. Reliab. 81: 41-63 (2018)

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