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ORCIDEero Ristolainen
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2000 – 2009
- 2006
[j12]Päivi H. Karjalainen, Eero Ristolainen:
Balancing temperature dependence of on-wafer SOS inductors. Microelectron. Reliab. 46(7): 1071-1079 (2006)- 2005
- [j11]Laura Frisk, Eero Ristolainen:
Flip chip attachment on flexible LCP substrate using an ACF. Microelectron. Reliab. 45(3-4): 583-588 (2005) - 2004
- [j10]S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö:
The effect of solder paste composition on the reliability of SnAgCu joints. Microelectron. Reliab. 44(3): 485-494 (2004) - [j9]Anne Seppälä
, Eero Ristolainen:
Study of adhesive flip chip bonding process and failure mechanisms of ACA joints. Microelectron. Reliab. 44(4): 639-648 (2004) - [j8]Laura Frisk, Anne Seppälä, Eero Ristolainen:
Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates. Microelectron. Reliab. 44(9-11): 1305-1310 (2004) - 2003
- [j7]S. Myllymaki, Eero Ristolainen, Pekka Heino, A. Lehto, K. Varjonen:
Evaluation Of Resonating Channel Transistor In SOI Wafer. Int. J. Comput. Eng. Sci. 4(3): 711-714 (2003) - [j6]Pekka Heino, Eero Ristolainen:
Thermal conduction at the nanoscale in some metals by MD. Microelectron. J. 34(9): 773-777 (2003) - [j5]Pekka Heino, Eero Ristolainen:
Strength of Ta-Si interfaces by molecular dynamics. Microelectron. Reliab. 43(4): 645-650 (2003) - 2002
- [j4]T. Alander, S. Nurmi, Pekka Heino, Eero Ristolainen:
Impact of component placement in solder joint reliability. Microelectron. Reliab. 42(3): 399-406 (2002) - [j3]Anne Seppälä, T. Allinniemi, Eero Ristolainen:
Failure mechanisms of adhesive flip chip joints. Microelectron. Reliab. 42(9-11): 1547-1550 (2002) - [j2]Erja Jokinen, Eero Ristolainen:
Anisotropic conductive film flip chip joining using thin chips. Microelectron. Reliab. 42(12): 1913-1920 (2002) - 2001
- [j1]Petteri Palm, Jarmo Määttänen, Aulis Tuominen, Eero Ristolainen:
Reliability of 80 mum pitch flip chip attachment on flex. Microelectron. Reliab. 41(5): 633-638 (2001)
Coauthor Index
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