"Study of adhesive flip chip bonding process and failure mechanisms of ACA ..."

Anne Seppälä, Eero Ristolainen (2004)

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DOI: 10.1016/J.MICROREL.2003.07.003

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type: Journal Article

metadata version: 2021-10-14

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Anne Seppälä, Eero Ristolainen:
Study of adhesive flip chip bonding process and failure mechanisms of ACA joints. Microelectron. Reliab. 44(4): 639-648 (2004)

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