"The effect of solder paste composition on the reliability of SnAgCu joints."

S. Nurmi et al. (2004)

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DOI: 10.1016/J.MICROREL.2003.08.004

access: closed

type: Journal Article

metadata version: 2020-02-22

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S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö:
The effect of solder paste composition on the reliability of SnAgCu joints. Microelectron. Reliab. 44(3): 485-494 (2004)

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