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2020 – today
- 2024
[c11]Emeric Perez, Carlos Augusto Berlitz, Yasser Moursy, Sami Oukassi, Bruno Allard, Gaël Pillonnet:
Miniaturized Solid-State Battery-Based DC-DC Switched Converter. ISCAS 2024: 1-5- [c10]Baptiste Gonon-Mathieu, Lucas de Araujo Pereira, Adrien Morel, Theo Lamorelle, Yasser Moursy, Frédéric Rothan, Ghislain Despesse, Gaël Pillonnet:
Piezoelectric DC-DC Converters Benchmark in Power Management Integrated Circuit Context. NewCAS 2024: 89-93 - 2023
- [c9]Bastien Giraud, Sebastien Ricavy, Yasser Moursy, Cyrille Laffond, Ilan Sever, Valentin Gherman, Manuel Pezzin, Florent Lepin, Mariam Diallo, Khadija Zenati, Sylvain Dumas, Maxim Vershkov, Alessandro Bricalli, Giuseppe Piccolboni, Jean-Philippe Noël, Anass Samir, Gaël Pillonnet, Yvain Thonnart, Gabriel Molas:
Benefits of Design Assist Techniques on Performances and Reliability of a RRAM Macro. IMW 2023: 1-4 - 2021
- [c8]Quentin Schmidt
, Adrien Morel, Yasser Moursy, Houssein Elmi Dawale, Gérard Billiot, Franck Badets:
Exploring the analytical boundaries of capacitive feedback transimpedance amplifiers. ICECS 2021: 1-4 - [c7]Yasser Moursy, Thiago Raupp da Rosa, Lionel Jure, Anthony Quelen, Sébastien Genevey, Lionel Pierrefeu, Emmanuel G. Collins Jr., Joerg Winkler, Jonathan Park, Gaël Pillonnet, Vincent Huard, Andrea Bonzo, Philippe Flatresse:
A 0.021mm2 PVT-Aware Digital-Flow-Compatible Adaptive Back-Biasing Regulator with Scalable Drivers Achieving 450% Frequency Boosting and 30% Power Reduction in 22nm FDSOI Technology. ISSCC 2021: 492-494
2010 – 2019
- 2017
- [c6]Yasser Moursy, Anthony Quelen, Gaël Pillonnet:
Challenges for fully-integrated resonant switched capacitor converters in CMOS technologies. ICECS 2017: 198-201 - [c5]Yasser Moursy, Anthony Quelen, Gaël Pillonnet:
Design of fully integrated resonance switched capacitor converters in FDSOI technology. NEWCAS 2017: 149-152 - 2016
- [b1]Yasser Moursy:
A methodology for analysis and verification of the substrate noise coupling in HV/HT integrated circuits for automotive applications. (Une méthodologie de conception pour l'immunisation des circuits intégrés HV/HT contre les couplages de substrat pour les applications automobiles). Pierre and Marie Curie University, Paris, France, 2016 - [j2]Pietro Buccella, Camillo Stefanucci, Hao Zou, Yasser Moursy, Ramy Iskander, Jean-Michel Sallese, Maher Kayal:
Methodology for 3-D Substrate Network Extraction for SPICE Simulation of Parasitic Currents in Smart Power ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(9): 1489-1502 (2016) - [j1]Hao Zou, Yasser Moursy, Ramy Iskander, Alexander Steinmair, Heimo Gensinger, Ehrenfried Seebacher, Jean-Paul Chaput, Marie-Minerve Louërat:
Using CAD Tool for Substrate Parasitic Modeling in Smart Power Technology. IEEE Trans. Circuits Syst. I Regul. Pap. 63-I(12): 2323-2333 (2016) - [c4]Yasser Moursy, Hao Zou, Ramy Iskander, Pierre Tisserand, Dieu-My Ton, Giuseppe Pasetti, Ehrenfried Seebacher, Alexander Steinmair, Thomas Gneiting, Heidrun Alius:
Towards automatic diagnosis of minority carriers propagation problems in HV/HT automotive smart power ICs. DATE 2016: 265-268 - [c3]Yasser Moursy, Raouf Khalil, Sergio Lecce, Vanni Poletto, Ramy Iskander, Marie-Minerve Louërat:
Mixed-signal PI controller in current-mode DC-DC buck converter for automotive applications. ISCAS 2016: 1610-1613 - [c2]Hao Zou, Yasser Moursy, Ramy Iskander, Jean-Paul Chaput, Marie-Minerve Louërat:
An adaptive mesh refinement strategy of substrate modeling for smart power ICs. ISCAS 2016: 2358-2361 - 2015
- [c1]Hao Zou, Yasser Moursy, Ramy Iskander, Camillo Stefanucci, Pietro Buccella, Maher Kayal, Jean-Michel Sallese:
Substrate noise modeling with dedicated CAD framework for smart power ICs. ISCAS 2015: 1554-1557
Coauthor Index
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