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2020 – today
- 2020
[j6]Chang-Chi Lee, Hou-Ming Chen, Chi-Chang Lu
, Bo-Yi Lee, Hsien-Chi Huang, He-Sheng Fu, Yong-Xin Lin:
A High-Precision Bandgap Reference With a V-Curve Correction Circuit. IEEE Access 8: 62632-62638 (2020)- [j5]Cadmus C. A. Yuan, Chang-Chi Lee:
Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package. IEEE Access 8: 143494-143501 (2020)
2010 – 2019
- 2019
- [c1]Chang-Chi Lee, Yu-Sung Liu, Chun-Hsiang Tseng, Jeng-Yue Chen, Fuh-Shyang Juang, Yung-Ying Chang, Hung-Chih Hsu:
Pesticide Residue Testing System for Fruits and Vegetables by Color Identification Technology. ICCE-TW 2019: 1-2 - 2017
- [j4]Hou-Ming Chen, Chang-Chi Lee, Shih-Han Jheng, Wei-Chih Chen, Bo-Yi Lee:
A Sub-1 ppm/°C Precision Bandgap Reference With Adjusted-Temperature-Curvature Compensation. IEEE Trans. Circuits Syst. I Regul. Pap. 64-I(6): 1308-1317 (2017) - 2013
- [j3]Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai:
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. Microelectron. Reliab. 53(2): 297-302 (2013) - 2012
- [j2]Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang:
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. Microelectron. Reliab. 52(11): 2851-2855 (2012) - 2011
- [j1]Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai:
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. Microelectron. Reliab. 51(8): 1372-1376 (2011)
Coauthor Index
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