"Solder Joint Reliability Modeling by Sequential Artificial Neural Network ..."

Cadmus C. A. Yuan, Chang-Chi Lee (2020)

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DOI: 10.1109/ACCESS.2020.3014156

access: open

type: Journal Article

metadata version: 2020-08-26

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Cadmus C. A. Yuan, Chang-Chi Lee:
Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package. IEEE Access 8: 143494-143501 (2020)

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