"Structural design guideline to minimize extreme low-k delamination ..."

Yi-Shao Lai et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.05.007

access: closed

type: Journal Article

metadata version: 2022-10-02

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Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang:
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. Microelectron. Reliab. 52(11): 2851-2855 (2012)

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