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ORCIDF. Patrick McCluskey
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- affiliation: University of Maryland, College Park, MD, USA
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2010 – 2019
- 2018
[j8]Subramani Manoharan, Chandradip Patel, F. Patrick McCluskey, Michael G. Pecht:
Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment. Microelectron. Reliab. 84: 197-207 (2018)- [j7]Shuji Nishimoto
, Seyed Ali Moeini, Toyo Ohashi, Yoshiyuki Nagatomo, F. Patrick McCluskey:
Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications. Microelectron. Reliab. 87: 232-237 (2018) - [j6]Nga Man Li, Subramani Manoharan, Diganta Das, F. Patrick McCluskey:
Analysis of indentation measured mechanical properties on Multilayer Ceramic Capacitors (MLCCs). Microelectron. Reliab. 88-90: 528-533 (2018) - [j5]Subramani Manoharan, Chandradip Patel, Stevan Hunter, F. Patrick McCluskey:
Mechanism of wire bond shear testing. Microelectron. Reliab. 88-90: 738-744 (2018) - 2014
- [j4]Pedro Quintero, F. Patrick McCluskey, B. Koene:
Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications. Microelectron. Reliab. 54(1): 220-225 (2014) - [j3]David Squiller, Hannes Greve, Elena Mengotti, F. Patrick McCluskey:
Physics-of-failure assessment methodology for power electronic systems. Microelectron. Reliab. 54(9-10): 1680-1685 (2014) - [j2]F. Patrick McCluskey, N. M. Li, Elena Mengotti:
Eliminating infant mortality in metallized film capacitors by defect detection. Microelectron. Reliab. 54(9-10): 1818-1822 (2014)
2000 – 2009
- 2006
- [j1]F. Patrick McCluskey, M. Dash, Z. Wang, D. Huff:
Reliability of high temperature solder alternatives. Microelectron. Reliab. 46(9-11): 1910-1914 (2006)
Coauthor Index
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