"Novel silver die-attach technology on silver pre-sintered DBA substrates ..."

Shuji Nishimoto et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.010

access: closed

type: Journal Article

metadata version: 2021-06-01

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Shuji Nishimoto, Seyed Ali Moeini, Toyo Ohashi, Yoshiyuki Nagatomo, F. Patrick McCluskey:
Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications. Microelectron. Reliab. 87: 232-237 (2018)

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