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H. Dobrinski

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2013
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J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel:
Effect of moisture swelling on MEMS packaging and integrated sensors. Microelectron. Reliab. 53(9-11): 1648-1654 (2013)

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