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Conference and Workshop Papers
- 2022
[c5]Maarten Rosmeulen, Cesar J. Lockhart de la Rosa
, K. Willems, S. Fransen, B.-Y. Shih, Devin Verreck, V. Kalangi, F. Yasin, Harold Philipsen, Y. T. Set, N. Ronchi, W. Van Roy, O. Y. F. Henry, Antonio Arreghini, Geert Van den Bosch, Arnaud Furnémont:
Liquid Memory and the Future of Data Storage. IMW 2022: 1-4- 2015
- [c4]Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes:
Impact of oxide liner properties on TSV Cu pumping and TSV stress. IRPS 2015: 4 - 2014
- [c3]Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka:
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. 3DIC 2014: 1-4 - 2011
- [c2]Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara:
Low temperature through-Si via fabrication using electroless deposition. 3DIC 2011: 1-4 - 2009
- [c1]Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne:
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 3DIC 2009: 1-4
Coauthor Index
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