"Cu seeding using electroless deposition on Ru liner for high aspect ratio ..."

Fumihiro Inoue et al. (2014)

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DOI: 10.1109/3DIC.2014.7152147

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka:
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. 3DIC 2014: 1-4

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