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S. J. Tesarski

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2012
[j1]
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E. R. Weltevreden, S. J. Tesarski, Artur Wymyslowski, Müge Erinc, Alexander W. J. Gielen:
A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging. Microelectron. Reliab. 52(7): 1300-1305 (2012)

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