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Winco K. C. Yung

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Journal Articles

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2024
[j7]
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  - journals/jim/HuangBLCY24
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  - https://dblp.org/rec/journals/jim/HuangBLCY24
Chao Huang, Siqi Bu, Hiu Hung Lee, Kwong Wah Chan, Winco K. C. Yung:
Prognostics and health management for induction machines: a comprehensive review. J. Intell. Manuf. 35(3): 937-962 (2024)
2021
[j6]
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  - journals/eswa/IbrahimJYF21
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Mesfin S. Ibrahim, Zhou Jing, Winco K. C. Yung, Jiajie Fan:
Bayesian based lifetime prediction for high-power white LEDs. Expert Syst. Appl. 185: 115627 (2021)
2015
[j5]
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  - journals/mr/ChangSPYW15
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Moon-Hwan Chang, Peter Sandborn, Michael G. Pecht, Winco K. C. Yung, Wenbin Wang:
A return on investment analysis of applying health monitoring to LED lighting systems. Microelectron. Reliab. 55(3-4): 527-537 (2015)
2011
[j4]
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  - journals/mr/GainCY11
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Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung:
Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO₂ composite solder on flexible ball grid array substrates. Microelectron. Reliab. 51(5): 975-984 (2011)
[j3]
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Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung:
Effect of additions of ZrO₂ nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 51(12): 2306-2313 (2011)
2010
[j2]
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  - journals/mr/FouzderGCSY10
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Tama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung:
Effect of nano Al₂O₃ additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 50(12): 2051-2058 (2010)
2009
[j1]
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  - journals/mr/GainCSWY09
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Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung:
Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. Microelectron. Reliab. 49(7): 746-753 (2009)

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