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ORCIDYoshinori Kohama
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2010 – 2019
- 2011
[j5]Kiichi Niitsu
, Yasufumi Sugimori, Yoshinori Kohama, Kenichi Osada, Naohiko Irie, Hiroki Ishikuro, Tadahiro Kuroda:
Analysis and Techniques for Mitigating Interference From Power/Signal Lines and to SRAM Circuits in CMOS Inductive-Coupling Link for Low-Power 3-D System Integration. IEEE Trans. Very Large Scale Integr. Syst. 19(10): 1902-1907 (2011)- 2010
- [j4]Mitsuko Saito, Yasufumi Sugimori, Yoshinori Kohama, Yoichi Yoshida, Noriyuki Miura, Hiroki Ishikuro, Takayasu Sakurai, Tadahiro Kuroda:
2 Gb/s 15 pJ/b/chip Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking. IEEE J. Solid State Circuits 45(1): 134-141 (2010) - [j3]Makoto Saen, Kenichi Osada, Yasuyuki Okuma, Kiichi Niitsu, Yasuhisa Shimazaki, Yasufumi Sugimori, Yoshinori Kohama, Kazutaka Kasuga, Itaru Nonomura, Naohiko Irie, Toshihiro Hattori, Atsushi Hasegawa, Tadahiro Kuroda:
3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link. IEEE J. Solid State Circuits 45(4): 856-862 (2010) - [j2]Kiichi Niitsu, Yoshinori Kohama, Yasufumi Sugimori, Kazutaka Kasuga, Kenichi Osada, Naohiko Irie, Hiroki Ishikuro, Tadahiro Kuroda:
Modeling and Experimental Verification of Misalignment Tolerance in Inductive-Coupling Inter-Chip Link for Low-Power 3-D System Integration. IEEE Trans. Very Large Scale Integr. Syst. 18(8): 1238-1243 (2010)
2000 – 2009
- 2009
- [j1]Noriyuki Miura, Yoshinori Kohama, Yasufumi Sugimori, Hiroki Ishikuro, Takayasu Sakurai, Tadahiro Kuroda:
A High-Speed Inductive-Coupling Link With Burst Transmission. IEEE J. Solid State Circuits 44(3): 947-955 (2009) - [c5]Mitsuko Saito, Yasufumi Sugimori, Yoshinori Kohama, Yoichi Yoshida, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda:
47% power reduction and 91% area reduction in inductive-coupling programmable bus for NAND flash memory stacking. CICC 2009: 449-452 - [c4]Shotaro Saito, Yoshinori Kohama, Yasufumi Sugimori, Yohei Hasegawa, Hiroki Matsutani, Toru Sano, Kazutaka Kasuga, Yoichi Yoshida, Kiichi Niitsu, Noriyuki Miura, Tadahiro Kuroda, Hideharu Amano:
MuCCRA-Cube: A 3D dynamically reconfigurable processor with inductive-coupling link. FPL 2009: 6-11 - [c3]Yasufumi Sugimori, Yoshinori Kohama, Mitsuko Saito, Yoichi Yoshida, Noriyuki Miura, Hiroki Ishikuro, Takayasu Sakurai, Tadahiro Kuroda:
A 2Gb/s 15pJ/b/chip Inductive-Coupling programmable bus for NAND Flash memory stacking. ISSCC 2009: 244-245 - [c2]Kiichi Niitsu, Yasuhisa Shimazaki, Yasufumi Sugimori, Yoshinori Kohama, Kazutaka Kasuga, Itaru Nonomura, Makoto Saen, Shigenobu Komatsu, Kenichi Osada, Naohiko Irie, Toshihiro Hattori, Atsushi Hasegawa, Tadahiro Kuroda:
An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. ISSCC 2009: 480-481 - 2008
- [c1]Noriyuki Miura, Yoshinori Kohama, Yasufumi Sugimori, Hiroki Ishikuro, Takayasu Sakurai, Tadahiro Kuroda:
An 11Gb/s Inductive-Coupling Link with Burst Transmission. ISSCC 2008: 298-299
Coauthor Index
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