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ORCIDInternational Journal of Manufacturing Technology and Management, Volume 9
Volume 9, Number 1/2, 2006
- Mark J. Jackson:
Micro-grinding electronic and optical materials using diamond-coated piezoelectric materials. 1-17 - Nobuyuki Moronuki, Yasunori Saito, Arata Kaneko:
Vibration micro-machining of low-melting temperature glass. 18-33 - Noritaka Kawasegi, Noboru Morita, Shigeru Yamada, Noboru Takano, Tatsuo Oyama, Kiwamu Ashida, Jun Taniguchi, Iwao Miyamoto, Sadao Momota:
Etching characteristics of a silicon surface induced by focused ion beam irradiation. 34-50 - Nobuhito Yoshihara, Tsunemoto Kuriyagawa, Hiromichi Ono, Katsuo Syoji:
Nano-topography on axisymmetric aspherical ground surfaces. 51-63 - Kiyoshi Suzuki, Yoshiaki Shishido, Nobuhiro Koga, Takeki Shirai, Manabu Iwai, Tetsutaro Uematsu:
Development of a crack cutting method for glass plates used for flat panel displays. 64-78 - Katsutoshi Tanaka, Masahiko Fukuta, Kiyoshi Suzuki, Manabu Iwai, Tetsutaro Uematsu, Syoji Mishiro:
Improvement of grinding performance in ultra-precision grinding of lens mould by the help of megasonic coolant. 79-93 - Kiyoshi Suzuki, Manabu Iwai, Anurag Sharma, Sadao Sano, Tetsutaro Uematsu:
Low-wear diamond electrode for micro-EDM of die-steel. 94-108 - Tsuyoshi Kaku, Tsunemoto Kuriyagawa, Nobuhito Yoshihara:
Electrorheological fluid-assisted polishing of WC micro aspherical glass moulding dies. 109-119 - Jun Shimizu, Libo Zhou, Hiroshi Eda:
Molecular dynamics simulation of vibration-assisted cutting: influences of vibration parameters. 120-129 - Libo Zhou, Zhongjun Qiu, Tomohiko Ishikawa, Tatsuo Kawakami, Hiroshi Eda:
Development of vision controlled bio-cell manipulation system. 130-143 - Arvind Chandrasekaran, Muthukumaran Packirisamy, Ion Stiharu, Andre Delage:
Hybrid bulk micro-machining process suitable for roughness reduction in optical MEMS devices. 144-159 - Yongbo Wu, Masana Kato:
Geometrical arrangement of ID grinding wheel in simultaneous-ID/OD combination centreless grinding. 160-171 - Nobuo Yasunaga, Yukiharu Yamamoto:
High temperature MCP process suitable for extremely hard high functional SiC wafers. 172-182 - Xijun Kang, Jun'ichi Tamaki, Akihiko Kubo:
Effect of cutting edge truncation on ductile-regime grinding of hard and brittle materials. 183-200
Volume 9, Number 3/4, 2006
- Toshimichi Moriwaki, Keiichi Shirase:
Intelligent machine tools: current status and evolutional architecture. 204-218 - Zezhong C. Chen, Zhibin Miao:
An intelligent approach to non-constant feed rate determination for high-performance 2D CNC milling. 219-236 - Dusan N. Sormaz
, Deepak V. Pisipati, Prashant A. Borse:
Virtual manufacturing of milling operations with multiple tool paths. 237-264 - Pingjun Xia, Yingxue Yao, Jiangsheng Liu, Jianguang Li:
Optimising assembly planning based on virtual reality and bionic algorithm. 265-293 - Da-Yin Liao, Min-Yi Tsai:
A quota-constrained, speed control model for production scheduling in semiconductor manufacturing. 294-308 - Qi Hao, Weiming Shen, Lihui Wang:
Collaborative manufacturing resource scheduling using Agent-based Web Services. 309-327 - Matthew Chiu, Hao Wen Lin, Sev V. Nagalingam, Grier C. I. Lin:
Inter-operability framework towards virtual integration of SMEs in the manufacturing industry. 328-349 - V. Dhanalakshmi, K. Sankaranarayanasamy, Subramaniam Arunachalam, S. C. Lenny Koh:
Extraction of simple and concatenated features from a wire frame model using IGES data. 350-371 - Gerald Weigert, Sebastian Werner, Sven Horn:
Simulation aided optimisation of manufacturing processes in university education. 372-386
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