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ORCID32nd Hot Chips Symposium 2020: Palo Alto, CA, USA
- IEEE Hot Chips 32 Symposium, HCS 2020, Palo Alto, CA, USA, August 16-18, 2020. IEEE 2020, ISBN 978-1-7281-7129-6
- Dan Belov:
AI Research at Scale-Opportunities on the Road Ahead. 1-88 - Sonu Arora, Dan Bouvier, Chris Weaver:
AMD Next Generation 7NM Ryzen™ 4000 APU "Renoir". 1-30 - Allan Skillman, Tomas Edsö:
A Technical Overview of Cortex-M55 and Ethos-U55: Arm's Most Capable Processors for Endpoint AI. 1-20 - Rabin Sugumar:
ThunderX3 Next-Generation Arm-Based Server. 1-19 - Irma Esmer Papazian:
New 3rd Gen Intel® Xeon® Scalable Processor (Codename: Ice Lake-SP). 1-22 - Xavier Vera:
Inside Tiger Lake: Intel's Next Generation Mobile Client CPU. 1-26 - Xiantao Zxt, Zhengxiao Zx, Justin Song:
High-density Multi-tenant Bare-metal Cloud with Memory Expansion SoC and Power Management. 1-18 - Florian Zaruba, Fabian Schuiki, Luca Benini:
A 4096-core RISC-V Chiplet Architecture for Ultra-efficient Floating-point Computing. 1-24 - Anthony Saporito:
The IBM z15 processor chip set. 1-17 - Carl Ramey:
Silicon Photonics for Artificial Intelligence Acceleration : HotChips 32. 1-26 - Jeff Andrews, Mark Grossman:
Xbox Series X System Architecture. 1-29 - Ilya K. Ganusov, Mahesh A. Iyer
, Ning Cheng, Alon Meisler:
Agilex™ Generation of Intel® FPGAs. 1-26 - David Blythe:
The Xe GPU Architecture. 1-27 - William J. Starke, Brian W. Thompto:
IBM's POWER10 Processor. 1-43 - Yang Jiao, Liang Han, Xin Long:
Hanguang 800 NPU - The Ultimate AI Inference Solution for Data Centers. 1-29 - Jack Choquette, Wish Gandhi:
NVIDIA A100 GPU: Performance & Innovation for GPU Computing. 1-43 - Francis Matus:
Distributed Services Architecture. 1-17 - Chen Chen, Xiaoyan Xiang, Chang Liu, Yunhai Shang, Ren Guo, Dongqi Liu, Yimin Lu, Ziyi Hao, Jiahui Luo, Zhijian Chen, Chunqiang Li, Yu Pu, Jianyi Meng, Xiaolang Yan, Yuan Xie, Xiaoning Qi:
Xuantie-910: Innovating Cloud and Edge Computing by RISC-V. 1-19 - Anurag Agrawal, Changhoon Kim:
Intel Tofino2 - A 12.9Tbps P4-Programmable Ethernet Switch. 1-32 - Jian Ouyang, Mijung Noh, Yong Wang, Wei Qi, Yin Ma, Canghai Gu, SoonGon Kim, Ki-il Hong, Wang-Keun Bae, Zhibiao Zhao, Jing Wang, Peng Wu, Xiaozhang Gong, Jiaxin Shi, Hefei Zhu, Xueliang Du:
Baidu Kunlun An AI processor for diversified workloads. 1-18 - Martin Voogel, Yohan Frans, Matt Ouellette, Jason Coppens, Sagheer Ahmad, Jaideep Dastidar, Ehab Mohsen, Faisal Dada, Mike Thompson, Ralph Wittig, Trevor Bauer, Gaurav Singh:
Xilinx Versal™ Premium. 1-46 - Glenn G. Ko, Yuji Chai, Marco Donato, Paul N. Whatmough, Thierry Tambe, Rob A. Rutenbar, Gu-Yeon Wei, David Brooks:
A Scalable Bayesian Inference Accelerator for Unsupervised Learning. 1-27 - Ljubisa Bajic, Jasmina Vasiljevic:
Compute substrate for Software 2.0. 1-31 - Thomas Norrie, Nishant Patil, Doe Hyun Yoon, George Kurian, Sheng Li, James Laudon, Cliff Young, Norman P. Jouppi, David A. Patterson:
Google's Training Chips Revealed: TPUv2 and TPUv3. 1-70 - Hot Chips 2020 Posters. 1-159
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