"Modeling Methodology for Reliability-Concerned Current Density Analysis of ..."

Yabin Zhang (2013)

> Home

Details and statistics

DOI: —

access: closed

type: Book or Thesis

metadata version: 2024-02-20

- view
  - electronic edition @ sbn.it
  - electronic edition @ sbn.it
- export record
  dblp key:
  - phd/it/Zhang13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/phd/it/Zhang13
Yabin Zhang:
Modeling Methodology for Reliability-Concerned Current Density Analysis of PCB Tracks and Thermal Analysis of PCB Structure. University of Pisa, Italy, 2013

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.