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ORCIDYabin Zhang 0003
Person information
- affiliation: Xihua University, School of Electrical Engineering and Electronic Information, Sichuan, China
- affiliation (PhD 2013): University of Pisa, Department of Information Engineering, Italy
Other persons with the same name
- Yabin Zhang — disambiguation page
- Yabin Zhang 0001
![[0000-0002-2179-3973]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0002-2179-3973")
— Hong Kong Polytechnic University, Department of Computing, Hong Kong (and 1 more) - Yabin Zhang 0002 — Nanyang Technological University, School of Computer Science and Engineering, Singapore
- Yabin Zhang 0004 — University of Michigan, Department of Mathematics, Ann Arbor, MI, USA (and 1 more)
- Yabin Zhang 0005 — Renmin University of China, Gaoling School of Artificial Intelligence, Beijing, China (and 1 more)
- Yabin Zhang 0006 — Zhengzhou University, School of Information Engineering, Department of Automation, School of Electrical Engineering, China
- Yabin Zhang 0007 — Chinese University of Hong Kong, CUHK, Department of Mechanical and Automation Engineering, Hong Kong
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2020 – today
- 2021
[j3]Yabin Zhang:
Improved Numerical-Analytical Thermal Modeling Method of the PCB With Considering Radiation Heat Transfer and Calculation of Components' Temperature. IEEE Access 9: 92925-92940 (2021)
2010 – 2019
- 2014
- [j2]Yabin Zhang, Paolo Emilio Bagnoli:
A modeling methodology for thermal analysis of the PCB structure. Microelectron. J. 45(8): 1033-1052 (2014) - 2013
- [b1]Yabin Zhang:
Modeling Methodology for Reliability-Concerned Current Density Analysis of PCB Tracks and Thermal Analysis of PCB Structure. University of Pisa, Italy, 2013 - 2010
- [j1]Paolo Emilio Bagnoli, Yabin Zhang:
Electro-thermal simulation of metal interconnections under high current flow. Microelectron. Reliab. 50(9-11): 1672-1677 (2010)
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