"On-Chip Interconnect Analysis of Performance and Energy Metrics Under ..."

Ling Zhang et al. (2011)

> Home

Details and statistics

DOI: 10.1109/TVLSI.2009.2035322

access: closed

type: Journal Article

metadata version: 2024-08-01

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tvlsi/ZhangZCYHC11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tvlsi/ZhangZCYHC11
Ling Zhang, Yulei Zhang, Hongyu Chen, Bo Yao, Kevin Hamilton, Chung-Kuan Cheng:
On-Chip Interconnect Analysis of Performance and Energy Metrics Under Different Design Goals. IEEE Trans. Very Large Scale Integr. Syst. 19(3): 520-524 (2011)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.