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"Via-Switch FPGA: Highly Dense Mixed-Grained Reconfigurable Architecture ..."
Hiroyuki Ochi et al. (2018)
- Hiroyuki Ochi, Kosei Yamaguchi, Tetsuaki Fujimoto, Junshi Hotate, Takashi Kishimoto, Toshiki Higashi, Takashi Imagawa, Ryutaro Doi, Munehiro Tada, Tadahiko Sugibayashi, Wataru Takahashi, Kazutoshi Wakabayashi, Hidetoshi Onodera, Yukio Mitsuyama, Jaehoon Yu, Masanori Hashimoto:
Via-Switch FPGA: Highly Dense Mixed-Grained Reconfigurable Architecture With Overlay Via-Switch Crossbars. IEEE Trans. Very Large Scale Integr. Syst. 26(12): 2723-2736 (2018)
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