"Enhanced Postbond Test Architecture for Bridge Defects Between the TSVs."

Jungil Mok, Hyeonchan Lim, Sungho Kang (2021)

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DOI: 10.1109/TVLSI.2021.3063651

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type: Journal Article

metadata version: 2024-02-27

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Jungil Mok, Hyeonchan Lim, Sungho Kang:
Enhanced Postbond Test Architecture for Bridge Defects Between the TSVs. IEEE Trans. Very Large Scale Integr. Syst. 29(6): 1164-1177 (2021)

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