"An Electrical-Thermal Co-Simulation Model of Chiplet Heterogeneous ..."

Xiaoning Ma et al. (2024)

> Home

Details and statistics

DOI: 10.1109/TVLSI.2024.3430498

access: closed

type: Journal Article

metadata version: 2025-03-03

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tvlsi/MaXWCLZL24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tvlsi/MaXWCLZL24
Xiaoning Ma, Qinzhi Xu, Chenghan Wang, He Cao, Jianyun Liu, Daoqing Zhang, Zhiqiang Li:
An Electrical-Thermal Co-Simulation Model of Chiplet Heterogeneous Integration Systems. IEEE Trans. Very Large Scale Integr. Syst. 32(10): 1769-1781 (2024)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.