"Fast Flip-Chip Pin-Out Designation Respin for Package-Board Codesign."

Ren-Jie Lee, Hung-Ming Chen (2009)

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DOI: 10.1109/TVLSI.2009.2017795

access: closed

type: Journal Article

metadata version: 2020-03-11

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Ren-Jie Lee, Hung-Ming Chen:
Fast Flip-Chip Pin-Out Designation Respin for Package-Board Codesign. IEEE Trans. Very Large Scale Integr. Syst. 17(8): 1087-1098 (2009)

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