"A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, ..."

Jinwoo Kim et al. (2024)

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DOI: 10.1109/TVLSI.2023.3342734

access: closed

type: Journal Article

metadata version: 2024-03-16

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Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim:
A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping. IEEE Trans. Very Large Scale Integr. Syst. 32(3): 401-412 (2024)

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