"Thermal-Aware Fixed-Outline 3-D IC Floorplanning: An End-to-End ..."

Wenbo Guan et al. (2023)

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DOI: 10.1109/TVLSI.2023.3321532

access: closed

type: Journal Article

metadata version: 2023-12-10

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Wenbo Guan, Xiaoyan Tang, Hongliang Lu, Yuming Zhang, Yimen Zhang:
Thermal-Aware Fixed-Outline 3-D IC Floorplanning: An End-to-End Learning-Based Approach. IEEE Trans. Very Large Scale Integr. Syst. 31(12): 1882-1895 (2023)

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