"A Novel Thermal-Aware Floorplanning and TSV Assignment With Game Theory ..."

Wenbo Guan et al. (2023)

> Home

Details and statistics

DOI: 10.1109/TVLSI.2023.3309595

access: closed

type: Journal Article

metadata version: 2023-10-27

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tvlsi/GuanTLZZ23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tvlsi/GuanTLZZ23
Wenbo Guan, Xiaoyan Tang, Hongliang Lu, Yuming Zhang, Yimen Zhang:
A Novel Thermal-Aware Floorplanning and TSV Assignment With Game Theory for Fixed-Outline 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 31(11): 1639-1652 (2023)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.