"Process Variation and Temperature-Aware Full Chip Oxide Breakdown ..."

Cheng Zhuo et al. (2011)

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DOI: 10.1109/TCAD.2011.2142183

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type: Journal Article

metadata version: 2020-09-24

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Cheng Zhuo, Kaviraj Chopra, Dennis Sylvester, David T. Blaauw:
Process Variation and Temperature-Aware Full Chip Oxide Breakdown Reliability Analysis. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 30(9): 1321-1334 (2011)

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