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"Placement of Thermal Vias in 3-D ICs Using Various Thermal Objectives."
Brent Goplen, Sachin S. Sapatnekar (2006)
- Brent Goplen, Sachin S. Sapatnekar:
Placement of Thermal Vias in 3-D ICs Using Various Thermal Objectives. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(4): 692-709 (2006)
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