"Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible ..."

Kenji Okabe et al. (2015)

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DOI: 10.3390/S151229885

access: open

type: Journal Article

metadata version: 2022-10-02

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  - https://dblp.org/rec/journals/sensors/OkabeJYKIA15
Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, Takeshi Kawano, Makoto Ishida, Ippei Akita:
Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems. Sensors 15(12): 31821-31832 (2015)

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