"Thermo-mechanical finite element analysis in a multichip build up ..."

Xiaowu Zhang et al. (2004)

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DOI: 10.1016/J.MICROREL.2003.09.006

access: closed

type: Journal Article

metadata version: 2020-10-26

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Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath:
Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectron. Reliab. 44(4): 611-619 (2004)

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