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2004
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Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath:
Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectron. Reliab. 44(4): 611-619 (2004)

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