"Modeling and simulation for a drop-impact analysis of multi-layered ..."

Yuqi Wang et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.05.007

access: closed

type: Journal Article

metadata version: 2023-09-30

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Yuqi Wang, K. H. Low, John H. L. Pang, Kay Hiang Hoon, F. X. Che, Y. S. Yong:
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. Microelectron. Reliab. 46(2-4): 558-573 (2006)

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