"Thermal reliability prediction and analysis for high-density electronic ..."

Yi Wan et al. (2016)

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DOI: 10.1016/J.MICROREL.2015.10.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yi Wan, Hailong Huang, Diganta Das, Michael G. Pecht:
Thermal reliability prediction and analysis for high-density electronic systems based on the Markov process. Microelectron. Reliab. 56: 182-188 (2016)

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