"Innovative packaging technique for backside optical testing of wire-bonded ..."

Alberto Tosi, Franco Stellari, Franco Zappa (2005)

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DOI: 10.1016/J.MICROREL.2005.07.044

access: closed

type: Journal Article

metadata version: 2020-02-22

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Alberto Tosi, Franco Stellari, Franco Zappa:
Innovative packaging technique for backside optical testing of wire-bonded chips. Microelectron. Reliab. 45(9-11): 1493-1498 (2005)

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