"Ultra-high-density interconnection technology of three-dimensional packaging."

Kenji Takahashi et al. (2003)

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DOI: 10.1016/S0026-2714(03)00167-7

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/TakahashiUTTNTTB03
Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka, Kazumasa Tanida, Yoshihiko Nemoto, Yoshihiro Tomita, Masamoto Tago, Manabu Bonkohara:
Ultra-high-density interconnection technology of three-dimensional packaging. Microelectron. Reliab. 43(8): 1267-1279 (2003)

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