"Degradation of thermal interface materials for high-temperature power ..."

Robert Skuriat et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.05.011

access: open

type: Journal Article

metadata version: 2024-07-06

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Robert Skuriat, Jianfeng Li, Pearl A. Agyakwa, Nevil Mattey, Paul Evans, C. Mark Johnson:
Degradation of thermal interface materials for high-temperature power electronics applications. Microelectron. Reliab. 53(12): 1933-1942 (2013)

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